3M™ High-Temperature Masking Liquid 2538 is an olefin hybrid adhesive that is specially formulated to offer excellent high-temperature resistance and low slump during processing. This specially formulated hot melt removes cleanly from various electronic substrates by peeling even after 10 min @ 260°C (500°F). The non-silicone formulation reduces the potential for silicone contamination which can interfere with subsequent bonding or conformal coating processes. The high-temperature resistance adhesive also possesses excellent chemical resistance and can be considered for demanding chemical masking applications.